Scanning Acoustic Microscopy (CSAM)

Acoustic Micro Imaging/AMI

Scanning Acoustic Microscopy, also known as C-SAM or Acoustic Micro Imaging or AMI, outstanding benefit is its ability to find hidden defects within assemblies and materials that can occur during manufacturing or environmental testing. Defects such as delaminations, voids and cracks can be identified and analyzed more effectively using Acoustic Microscopy than with any other inspection method.

Unlike other non-destructive techniques such as X-Ray and Infrared Imaging, Acoustic Microscopy is highly sensitive to the elastic properties of the materials it travels through. Because of this, the ability of Acoustic Microscopy to find and characterize these physical defects is clearly superior. Typical applications include production control, failure analysis, and product development.

Through the use of ultra-high frequency ultrasound, C-SAM non-destructively finds and characterizes physical defects—such as cracks, voids, delaminations and porosity— that occur during manufacturing, environmental testing or even under normal component operation. Because of the unique aspects of the technology, AMI can locate these defects better than any other inspection method.

C-Sam versus other Techniques:

C-SAM and X-ray are complementary techniques that are frequently found in the same laboratories, but they reveal different features. Where X-ray relies on differential attenuation of the X-ray energy, AMI relies on material change. The practical result is that AMI is orders of magnitude more sensitive for detecting air space type defects such as voids, delaminations and cracks.