Solderability

IPC/ECA J-STD-001, J-STD-002, J-STD-003; MIL-STD-202, Method 208; MIL-STD 883, Method 2003.10; IPC-TM-650, Method 2.4.12

The Solderability test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages.

Solderability testing provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using SnPb or Pb-free solder. The procedure, considered to be destructive, will test whether the packaging materials and processes used during the manufacturing operations produce a component that can be successfully soldered in the next level assembly.

There are two methods of solderability testing. Method 1 is known as “dip and look” which is for leaded and leadless terminations. This method includes pre-conditioning if applicable, the application of flux, and the immersion of the terminations into molten solder. Method 2 is a Surface Mount Process Simulation test.

The purpose of this test method is to provide a means of determining the solderability of the device package terminations that are intended to be joined to another surface using lead- (Pb-) containing or Pb-free solder for the attachment.