T: 714.999.1616 | F: 714.999.1636
Russell Shepherd - Operations Manager
NTS Anaheim is the Leader in Materials Analysis
NTS Anaheim provides the highest level of support and testing services. We are one of two materials analysis laboratories with expertise in commercial, aerospace, military aerospace and automotive markets worldwide.
Recognized as an industry leader, our capabilities extend beyond those of a typical test and R&D facility. Through involvement in professional industry groups, NTS has earned a reputation for uncommon insight and visionary thinking. We understand the value and benefits of a comprehensive LIMS and apply it in our daily operations.
Our technical staff is sought after for its exceptional skills and experience and in fact are often requested to weigh in on various engineering and test program issues. We share that knowledge by authoring articles, conducting seminars and chairing national and international committees.
Printed circuit boards are the foundation for any printed circuit assembly. Our highly-qualified staff of mechanical and chemical engineers can perform physical, mechanical, electrical, visual/dimensional testing and verification at the bare board level on raw materials and assembled PCBAs. This includes evaluation to both military and commercial standards, including IPC certifications and test methods MIL-STD-810, MIL-PRF-55110, MIL-PRF-31032, MIL-P-50884, ASTM and IEC.
More Than 25 Years’ Experience in Failure Analysis
Not only have we put in the time to master failure analysis, we continue to hone our expertise. This has garnered NTS Anaheim the honored recognition of being a global leader in independent materials analysis.
Our failure analysis program can provide detailed information about the performance of materials and devices for end-use applications, as well as root-cause analyses. This allows you to identify design, select, test and process deficiencies and take corrective action to enhance product reliability and performance. Our unbiased analysis converts your failure into success, helping you roll out higher quality products.
At NTS Anaheim, we know that when a device or product fails, you need to understand why it happened and how to correct the problem in the future. This is when our root cause analysis can be of great use. Since failure is rarely due to one single mistake, our multidisciplinary approach includes everything from chemical and environmental analyses to simulation tests and visual inspections. Plus, with our vast testing experience, we run only the necessary tests to efficiently get to the root cause of the failure you want to correct.
A core capability, NTS Anaheim has a longstanding record of success in partnering with the electronics and printed circuit board (PCB) industries. Our engineers routinely provide test program insight and development; allowing you the flexibility to enhance and/or structure programs to your specifications.
Using tensile test machines, impact testers, bend and fatigue machines and computers with state-of-the-art programmable software, our engineers mechanical test run programs for clients in electronics, composites, plastics, aerospace, automotive, medical, commercial and defense.
NTS Anaheim is a fully Certificated Lab under UL’s Third-Party Test Data Program (TPTDP) and Client Agent Program (CAP). We provide end-to-end engineering, administrative and testing services so you have the dedicated resources and knowledge to achieve UL recognition.
UL Test Capabilities Include:
|UL-94||Flammability of Plastic Materials
- 94HB Horizontal Buring Test
- 94V-0, V-1, or V-2 Vertical Burning Testing
- VTM-0, VTM-1, or VTM-2 Thin Material Vertical Burning Test
|UL 764A||Polymeric Materials —Short Term Property Evaluations|
|UL 746B||Polymeric Materials —Long Term Property Evaluations
-Relative Thermal Index Based Long Term Thermal Aging (LTTA)
|UL 746E||Polymeric Materials —Industrial Laminates, Filament Wound Tubing, Vulcanized Fiber and Materials Used in Printed Wiring Boards|
|UL 746F||Polymeric Materials —Flexible Dielectric Film Materials for use in Printed Wiring Boards and Flexible Materials Interconnect Constructions|
|UL 796||Printed Wiring Boards|
|UL 796F||Flexible Materials Interconnect Constructions|
|UL Subject 5703||Outline of Investigation for Determination of the Maximum Operating Temperature Rating of Photovoltaic (PV) Materials|
As an industry leader in micro-sectional analysis, we offer one of the most proven methods to accurately test for the through-hole integrity of printed circuit boards. Since PCBs are constructed of various materials and layers including glass, fibers, metals, adhesives and epoxies, it is critical to product safety to determine the reliability of PCB microsections. In addition, we offer micro-sectional analysis training, so your staff can perform this testing in-house if you prefer.
Research and Development
Our Research and Development team has more than 25 years of experience providing R&D test services, analysis and consulting on electronics and materials. Our laboratories are equipped with the most advanced instrumentation to customize a program to best meet your development requirements. A partial list of NTS R & D capabilities includes:
- Differential Scanning Calorimetry (DSC)
- Dynamic Mechanical Analysis (DMA)
- Energy Dispersive X-Ray (EDS)
- Failure Analysis (F/A)
- Fourier Transform Infrared Spectroscopy (FTIR)
- Ion Chromatography (IC)
- Scanning Acoustic Microscopy (CSAM)
- Scanning Electron Microscopy (SEM)
- Thermal Conductivity
- Thermal Gravimetric Analysis (TGA)
- Thermal Mechanical Analysis (TMA)
- X-Ray (Live-time, non-destructive inspection of package)
- X-Ray Flourescence (XRF)