NEBS (Network Equipment Building Systems) is the generic requirement for the spatial environmental, EMI/EMC, and product safety of telecom equipment being deployed in the Central Office locations of the North American Public Switch Telephone Network. These requirements are mandated by the RBOCs (Regional Bell Operating Companies) providing confidence that equipment has a high degree of reliability and will work under extreme environments while maintaining service for their customers.
NTS provides complete NEBS testing worldwide to meet the needs of our clients. With multiple labs located in the United States, Canada, and Germany, NTS provides extensive engineering services and program management to help clients understand and comply with these stringent NEBS standards reducing product development and deployment time to market.
The NTS NEBS quality program provides continuing compliance for products through their entire life cycle. By maintaining compliance through the life of the product, clients maintain the integrity of their equipment and can prevent expensive recalls. The NTS NEBS mark is recognized through-out the telecom industry as a quality standard that ensures product reliability. When displayed the mark assures potential buyers that the equipment has met the NEBS requirements and was tested by a quality organization.
Click here for more information about the NTS NEBS Certification Mark.
NTS is now a Verizon-certified TMST ITL
NTS was recently certified by Verizon as an independent test lab to support the new Verizon thermal modeling, simulation, and test (TMST) initiative. The TMST program, with its corresponding purchasing requirement VZ.TPR.9208, aims to reduce the amount of energy required to remove heat and keep telecommunications equipment cool. This is accomplished through a combination of material selection, computational fluid dynamics analysis, and suitable fan selection.
NTS is prepared to help you at any stage in your product design cycle: from CFD thermal analysis during conceptual design to thermal optimization and component/board placement to final TMST certification.
